RESEARCH ARTICLE

 

Galvanostatic electrodeposition of Ni-Co alloys in DMSO under a magnetic field

 

 

Mehdi Ebadi^*; Wan Jeffrey Basirun; Yatimah Alias; Mohammad Reza Mahmoudian

Department of Chemistry, Faculty of Science, University of Malaya, 50603 Kuala Lumpur, Malaysia

 

 

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ABSTRACT

This paper focuses on the galvanostatic magneto-electrodeposition of Ni-Co alloys in dimethyl sulphoxide (DMSO) in the presence and absence of a permanent parallel magnetic field (PPMF) to the cathode surface. It was found that the mass deposition was enhanced in the presence of PPMF (9 T) compared with the deposition without PPMF. The percentage enhancement potential was elevated (ξ₅% = 23.11, ξ₂% = 10.65, ξ₀₅% = 4.85) with current densities of 5,2 and 0.5 mA cm^-2, respectively, in the presence of PPMF (9 T). Atomic force microscopy (AFM) showed that the roughness of the Ni-Co alloy films was reduced from 56.187 to 31.716 nm (at 0.2 mA cm^-2) and 97.541 to 52.644 nm (at 0.5 mA cm^-2) with applied PPMF (9 T) compared with that without the PPMF. The deposited layers were characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy dispersive X-ray analysis (EDX).

Keywords: Potential enhancement, roughness, DMSO, magnetic electrodeposition

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Full text available only in pdf format.

 

Acknowledgements

We thank the University of Malaya for financial support from University research grant PS 388/2008C and UMCiL grant (TA2009/2008A). One of the authors (Mehdi Ebadi) is thankful for a fellowship from the University of Malaya.

 

References

1 E. Pál and I. Dékány, Col. Sur. A, 2008, 318, 141-150.         [ Links ]

2 P. Heoa, R. Ichino and M. Okido, Electrochim. Acta, 2006, 51, 6325-6330.         [ Links ]

3 J. Fu, D. Gao, Y. Xu and D. Xue, Electrochim. Acta, 2008, 53, 5464-5468.         [ Links ]

4 P. Liu, Q. Yang, Y. Tong and Y. Yang, Electrochim. Acta, 2000, 42, 2147-2152.         [ Links ]

5 G. Li, Y. Tong and G. Liu, J. Electroanal. Chem, 2004, 562, 223-229.         [ Links ]

6 M.C. Lefebvre andB.E. Conway, J. Electroanal. Chem., 2000, 480, 34-45.         [ Links ]

7 G.-R. Li, Q.-F. Ke, G.-K. Liu, P. Liu and Y.-X. Tong, Mat. Lett., 2007, 61, 884-888.         [ Links ]

8 T. Watanabe, Nano-Plating, Elsevier Science, Oxford, UK, 2004, pp. 163-170.         [ Links ]

9 O. Lioubashevski, E. Katz and I. Willner, J. Phys. Chem. C, 2007, 111, 6024-6032.         [ Links ]

10 O. Lioubashevski, E. Katz and I. Willner, J. Phys. Chem. C, 2004, 108, 5778-5784.         [ Links ]

11 G. Hinds, J.M.D. Coey and M.E.G. Lyons, Electrochem. Comm., 2001, 3, 215-218.         [ Links ]

12 M. Ebadi, W.J. Basirun and Y. Alias, Asian J. Chem., 2009, 21, 7354-7362.         [ Links ]

13 M. Ebadi,W.J. Basiruna nd Y. Alias, Asian J. Chem.,2009, 21,6343-6353.         [ Links ]

14 A. Ispas, H. Matsushima, W. Plieth and A. Bund, Electrochem. Acta, 2007, 52, 2785-2795.         [ Links ]

15 M. Ebadi, W.J. Basirun, Y. Alias and M. R. Mahmoudian, Chem. Cent. J., 2010, 4, 14.         [ Links ]

16 I. Tabakovic, S. Riemer, V. Vas'ko, V. Spozhnikov and M. Kief, J. Electrochem. Soc, 2003, 150, C635-C640.         [ Links ]

17 H. Matsushima, T. Nohira, I. Mogi and Y. Ito, Sur. Coat. Tech, 2004, 179, 245-251.         [ Links ]

18 M. Ebadi, W.J. Basirun and Y. Alias, J. Chem. Sci, 2009, 112, 279-285.         [ Links ]

19 A. Ispas, H. Matsushima, A. Bund and B. Bozzini, J. Electroanal. Chem., 2009, 626,174-182.         [ Links ]

20 J.A. Koza, M. Uhemann, C. Mickel, A. Gebert and L. Schultz, J. Mag. Mat., 2009, 321, 2265-2268.         [ Links ]

 

 

Received 18 February 2010
Revised 21 December 2010
Accepted 14 January 2011

 

 

* To whom correspondence should be addressed. E-mail: mehdi_2222002@yahoo.com